To meet the ultra-precision printed circuit board technology development and lead-free process of the international environment, our company has introduced anti-oxidants OSP process. XYOSP-211 is a heat resistant antioxidant dedicated copper surface of the circuit board, it can replace the hot air leveling effect and other metal surface treatment. After XYOSP-211 treatment, PCB copper surface and each layer through holes were covered with sturdy and protective organic film, this film can be maintained smooth copper surface and to prevent re-oxidation of the copper surface. XYOSP-211 deposition rationale is to rely XYOSP-211 and the surface of the metal copper to produce complex reaction, formation of the organic metal health, then thickened to the desired thickness on BENZIMIDAZOLE (0.15um ~ 0.55um). XYOSP-211 anti-oxidants has the following advantages: 1, affordable, the amount per unit area of ??a small circuit board, that board area per unit weight of pharmaceutical processing large, generally can handle 20-40 square meters per liter of syrup. 2, additional convenience. The company has additional liquid concentrate, avoiding the old fluid must first scoop out each time additional trouble, improve efficiency in the use of medicine, and simplifies operation. 3, liquid and stable performance, long-term storage. (Usually valid for one year) 4, film uniformity, Paul welding a long time. At least six months in ordinary plastic bags can be stored under vacuum packaging can be stored for 12 months. 5, is particularly suitable for the use of certain single panel.